덕산넵코어스

R&D

Production Facilities

  • Solder Printer
    Solder Paste Inspection(SPI)
  • Mount
  • AOI
  • Reflow

Solder Printer / Solder Paste Inspection(SPI)

Production Process Equipment Model Production Capacity Description
Solder Printer US-2000X
  • - Fram Max SIZE 736*736
  • - Auto Cleaning Teaching
Solder Paste Inspection SIMAX
  • - 420 mm × 350 mm
  • - Scan Camera 65 cm2/sec @ 14×14 μm resolution
  • - SPCworks: Statistical process control

Mount

Production Process Equipment Model Production Capacity Description
Mount Decan F2
  • - Chip 80,000CPH
  • - PCB Support (MAX): 510 × 460 (Standard)
  • - 10 Spindle x 2 Gantry
  • - Component Placement: 0402 chips to □14 mm, H12 mm
Mount Decan L2
  • - Chip 56,000CPH
  • - PCB Support (MAX): 510 × 460 (Standard)
  • - 6 Spindle x 2 Gantry
  • - Component Placement: 0402 chips to max. □55 mm, L75 mm (H25 mm)

AOI

Production Process Equipment Model Production Capacity Description
AOI 5K-SPECTRO
  • - PCB Max : 490 x 510mm
  • - Camera : 8M pixel, 12 bits CCD
  • - Inspection resolution : 4.75㎛
  • - Lighting colors : SPECTRO (White, Red, Blue)

Reflow

Production Process Equipment Model Production Capacity Description
Reflow Heller 1809MKⅢ
  • - 4,650 X 1,590 X 1,600(LxWxH)
  • - Heater Zone 10 + Cool Zone 2
  • - Max Setting Temperature: 400°C
  • - N2 Performance: Max 100 PPM

Quality Inspection Equipment and Methods

SPI Equipment for Mounting Inspection

AOI Equipment for Mounting Inspection

  • 0603 Solder Joint

  • Scan-based Inspection

  • SOIC8 Flatness
    Inspection

  • Inspection Using
    Camera Reflection